The Development of Flip-Chip Package Technology for High Frequency GaAs Device Applications
碩士 === 國立交通大學 === 材料科學與工程系 === 90 === This thesis presents a low cost solder bumping flip chip packaging technology for high frequency GaAs device applications to replace the wire bonding technology to achieve better RF performance for the devices at high frequencies. The devel...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/24066625343920182316 |