Characterization of Deuterium Post-Metallization Anneal of Copper Films and Barrier Layers
碩士 === 國立暨南國際大學 === 電機工程學系 === 90 === The main purpose of this thesis is to study the influence of applying deuterium (D2) post-metallization-anneal (PMA) to electro-chemical plating (ECP) Cu films deposited on different barrier layer materials. Since the self-annealing behavio...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/77858257153604514087 |