Numerical Study on Classification of Powder by Means of Transverse Blowing Wind

碩士 === 國立成功大學 === 航空太空工程學系碩博士班 === 90 === The growth of the integrated circuit (IC) and semiconductor industry causes a need of great amount of solder paste, which is mainly imported from foreign countries. There exists an urgent need to produce the solder paste domestically; however, the specificat...

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Bibliographic Details
Main Authors: Chao-Hui Wu, 吳昭輝
Other Authors: Keh-Chin Chang
Format: Others
Language:zh-TW
Published: 2002
Online Access:http://ndltd.ncl.edu.tw/handle/vs6unj

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