| Summary: | 碩士 === 國立成功大學 === 航空太空工程學系碩博士班 === 90 === A numerical method is developed to investigate the three-dimensional conjugate heat transfer of natural convection and conduction problems in a cubic enclosure. The Rayleigh number is selected between 10 to10 . The numerical method applied a finite-volume technique to solve the three -dimensional steady Navier-Stokes equations. The artificial compressible method, a third-order upwind finite volume method, DDADI time integration and an implicit residual smoothing were applied in the numerical method to achieve a higher-order accurate method.
In this article, we are concerned with the three-dimensional iterative- coupled heat conduction-convection problem for three heated chips mounted on a conductive substrate in a cubic enclosure filled with air. The chips are assumed to have uniform properties, with internal heat generation rate of Q [W], are mounted by different arrangements (Vertical, Horizontal, and Bottom). The main objective of the present work is to simulate the effect of Rayleigh number and substrate thermal conductivity on the three-dimensional natural convection flow within the cubic and on the heat transfer from the chips.
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