Die Bond Process Optimal Design for Fillet Height Control at Film BGA
碩士 === 國立成功大學 === 工程科學系專班 === 90 === Die bond process was an important process connected with IC’s wafer and assembly manufacture. It taked charge to pick up dies to substrate from wafer and adhesion together by taking advantage of glue, so it’s quality was more important. Recently we found die crac...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/56689736420997258629 |