A study of the copper process in ultra scale intergrated circuits using ion beam sputtering deposition
碩士 === 國立中興大學 === 材料工程學研究所 === 90 === Abstract Copper is in place of replaces aluminum as the advanced interconnect material in the ULSI industry because of its lower resistivity and better performance in electromigration. Currently, copper is deposited by electroplating. Howe...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/68432794438221100442 |