The Cost-Benefit Analysis of Alternative Electronics- A Case Study of Pin In Paste Process

• Main Authors: Jung- Reng Lin, 林俊仁
• Other Authors: Chien-Yi Huang
• Format: Others
• Language: zh-TW
• Published: 2002
• Online Access: http://ndltd.ncl.edu.tw/handle/89750587434146843219

碩士 === 華梵大學 === 工業管理學系碩士班 === 90 === Pin in Paste (PIP) process is used for the assembly of mixed Printed Circuit Board (PCB) design by the major notebook manufacturers in Taiwan. This process helps reduce the manufacturing cycle time, increase production volume, and concurrently reduce the cost of manufacturing for each board produced (or assembled). In additions, pin in paste process also facilitates the automation of component placement. While through hole connectors are manually placed in traditional process, PIP process utilizes pick-and-placement machines to assembly odd form connectors. The change in production process will have an impact on the unit cost of PCB. This research is to analyze the various aspects relating to production cost and to ensure the process yield. First, the several factors that affect the process yield of PIP process were determined. The traditional process and PIP process within a notebook manufacturing environment was then compared. The major factors that contribute to the manufacturing cost were identified. Those factors include process equipment, material, labor, factory, electrical consumption and replacement cost. Based on theories in engineering economics, a cost estimation formula was developed. Simulation software was used to estimate the throughputs of the two alternative processes. Finally, by integrating the results provided by the cost estimation formula and throughput simulation, a decision support system was constructed to evaluate the global performance of the two processes based on the unit cost of PCB. Sensitivity study was also done to further investigate the influence of several uncertain factors on the process performance. This proposed model could be used to evaluate the appropriateness of implementing PIP process in other manufacturing environment such as cell phone, PDA, and e-household appliances etc.