| Summary: | 碩士 === 長庚大學 === 半導體研究所 === 90 === With the prosperous development of information technology,
wireless communication system using for information transmission take advantages of real-time, high-speed, and no limitation of time and space. Therefore, Wireless Communication System will become the medium for the future communication industry. The reach and design of RF-front-end
will be the topic to the Wireless LAN system in the future. So, how to effectively reduce research times, decrease power loss, save product cost, shrink the electric circuit , and alter electric circuit characters are our devotes to develop in the future.
The purpose of this thesis is to develop the circuit configuration of power amplifier for high frequency front-end module. We will propose various design technique to design microwave Power Amplifier using MMIC and PCB. Design of high frequency 5GHz band Power Amplifier for Wireless LAN standard in the future, including : (1)High linear MMIC class A Power Amplifier, it takes a way of bias circuit to keep on the base current stability , increase linear and decrease distraction.
(2)High Power MMIC class B Power Amplifier, it takes a way of series resonant circuit to limited second and third harmonic signal to get highter Power Added Efficiency in the output port. (3)5GHz PCB Power Amplifier.
It is believed that the proposed RF power amplifier circuit configuration can be applied to a low-cost small-size mobile equipment.
Further research on the integration of other transmitter components will be conducted in the future.
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