EMC-Induced Thermal Deformations and Residual Stresses in IC Packaging
碩士 === 長庚大學 === 機械工程研究所 === 90 === EMC-induced thermal deformations and residual stresses in IC packaging are investigated experimentally, theoretically and numerically. A real-time Twyman-Green interferometry is used for measuring the out-of-plane deformations, while dynamic mechanical...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/76072561309300281131 |