Application of Enhanced Boiling Surface for Chip Cooling
碩士 === 長庚大學 === 機械工程研究所 === 90 === ABSTRACT This experimental study investigated the effect of particle size and coating thickness of the porous surface on evaporator thermal resistance of the thermosyphon having a 16 mm diameter circular heating area. Copper particles having...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/58917263311095451917 |