The Deformation Study of CVD Diamond Lead Bond Tool at Elevated Temperature Using Electronic Speckle Pattern Interferometry

• Main Authors: Wei-Shu Wang, 王偉書
• Other Authors: Song-Ren Huang
• Format: Others
• Language: zh-TW
• Published: 2002
• Online Access: http://ndltd.ncl.edu.tw/handle/99536680638674573690

碩士 === 國立中正大學 === 機械系 === 90 === Because the characteristics of non-destructive , non-contact and whole-field measurement, optical metrology quickly becomes the important measurement technique in the experiment mechanics. The most important reason is that the optical metrology has the high measure precision, and combines the digital image deal system. It can be popularly put in use on the domain of the precise measurement. This paper on the ability of electrical speckle pattern interferometry (ESPI) measures a static surface deformation induced by thermal load on lead bond tool. At least to the authers’ knowledge, there exist surprisingly few reports on optical full-field measurements of hot objects and that surface almost like a mirror. The most challenge in this experiment is that we will have a precise measurement at a limited resource. For the accuracy of the experimental measurement, we have another measure and analysis method, i.e. Michelson interferometer and finite element method. First, we put the lead bond tool on a heater and heating up 500℃, and we will catch the speckle image at the same time by CCD camera. In this ESPI experiment, the two frames of the digital picture corresponding to the specimen in its initial and deformed states are stored and processed at short-range interval in the personal computer. Processed images (fringe pattern) are then displaed on the monitor and are simultaneously recorded in the computer. We will get phase shift and electrical speckle pattern interferometry can be clearly record the deformation of start to end. We will have the other data at the same time, it can use to be a basis of the analysis future.