| Summary: | 碩士 === 元智大學 === 化學工程研究所 === 89 === In the future trend, the electronic products are moving to lighter, thinner, shorter and smaller, especially for mobile communication equipment, notebook, handy monitor, mobile medical equipment, space and defense electronic system. Flip chip package technology is the best one that we went to achieve those goods. It has following advantages: such as larger thermal transfer area, reduction of interference and noise, suitable for high frequency product, can be used in highest density of Input / Output and lowest device footprint.
In this study, we select the memory device that is used in computer normally as an object of this study. We use 4 of 128 x 8 Static Random Access Memory（SRAM）, with flip chip package we assembly these chips to a Multi Chip Module. In the study progress we use ceramic substrate and FR-4 substrate to be the substrate of Multi Chip Module. During the failure progress, we want to reduce the possible failure factor, we use the wire bonding process for dies on board, make sure which factor is the major cause of the failure. Then we go back to the flip chip package process, finally we successfully develop this Multi Chip Module based on flip chip package.
In this paper, except going through the detail process, we also introduce the manufacture support equipment and process techniqure in the chapter of theory and technology.
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