| Summary: | 碩士 === 國立臺北科技大學 === 製造科技研究所 === 89 === This study attempts to develop a kind of machine tools, which is able to cut nonconducting material. Its cutting precision shall be able to be compared with traveling-wire electrical discharge machining, but can also cut nonconducting materials. This machine tool is a kind of NC machine tool using PC-based controller, used to cut some projected shapes which can be defined on a single axis, X-Y dual axes or multiple axis. The said machine is to use one diamond wire loop with motion on direction of Z-axis or a certain direction, to attain the function of cutting. This cutting machine includes top and bottom wire guide pulley which are installed upper and lower the workpiece, surround the diamond wire, expect to be able to support the reaction force incurred during component cutting by the diamond wire. This machine also includes an auto wire tension control mechanism. While diamond wire saw is cutting, it could be able to maintain a constant wire tension. Thus, the wire could be kept as straight as possible and not to cause shifting from the feeding direction. Besides, a tension sensor is also installed over the roller, used to know the cutting force and reactions of a component so as to adjust the drawing speed and feed speed. For a long time, most of the material used to make a die is conductive material. In the recent yeas, such nonconducting materials as ceramics and composites have also been massively applied, however a difficult issue of how to cut into the desire shape is encountered. The theory and technology developed in this study, if applied to design a single-axis machine tool, can focus on column slicing, such as a silicon wafer. If applied to design a machine tool of dual axes or multiple axis, it can cut a more complicated shape.
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