Studies of Kinetic Mechanisms and Thermal Stability of Electroless Deposited Cu / Co(W)-P Thin-Film Metallization System
碩士 === 國立海洋大學 === 材料工程研究所 === 89 === Traditional IC fabrication , aluminum usually used to deposition the metal line. But When metal line developing to 0.25μm、0.18μm. Traditional PVD-Al already can’t conform IC fabrication requirement. Copper has higher melting point and lower specific re...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/56078459292441058055 |