Diffusion barrier effect on the thermo-mechanical properties of electroless copper thin films

碩士 === 國立清華大學 === 材料科學工程學系 === 89 ===

Bibliographic Details
Main Author:	許嘉麟
Other Authors:	JOW-HUEI JOU
Format:	Others
Language:	zh-TW
Published:	2001
Online Access:	http://ndltd.ncl.edu.tw/handle/52908427997634415699

id	ndltd-TW-089NTHU0159036
record_format	oai_dc
spelling	ndltd-TW-089NTHU01590362016-01-29T04:33:41Z http://ndltd.ncl.edu.tw/handle/52908427997634415699 Diffusion barrier effect on the thermo-mechanical properties of electroless copper thin films 擴散阻礙層對無電鍍銅膜熱機械性質之影響許嘉麟碩士國立清華大學材料科學工程學系 89 JOW-HUEI JOU 周卓煇 2001 學位論文 ; thesis 58 zh-TW
collection	NDLTD
language	zh-TW
format	Others
sources	NDLTD
description	碩士 === 國立清華大學 === 材料科學工程學系 === 89 ===
author2	JOW-HUEI JOU
author_facet	JOW-HUEI JOU 許嘉麟
author	許嘉麟
spellingShingle	許嘉麟 Diffusion barrier effect on the thermo-mechanical properties of electroless copper thin films
author_sort	許嘉麟
title	Diffusion barrier effect on the thermo-mechanical properties of electroless copper thin films
title_short	Diffusion barrier effect on the thermo-mechanical properties of electroless copper thin films
title_full	Diffusion barrier effect on the thermo-mechanical properties of electroless copper thin films
title_fullStr	Diffusion barrier effect on the thermo-mechanical properties of electroless copper thin films
title_full_unstemmed	Diffusion barrier effect on the thermo-mechanical properties of electroless copper thin films
title_sort	diffusion barrier effect on the thermo-mechanical properties of electroless copper thin films
publishDate	2001
url	http://ndltd.ncl.edu.tw/handle/52908427997634415699
work_keys_str_mv	AT xǔjiālín diffusionbarriereffectonthethermomechanicalpropertiesofelectrolesscopperthinfilms AT xǔjiālín kuòsànzǔàicéngduìwúdiàndùtóngmórèjīxièxìngzhìzhīyǐngxiǎng
_version_	1718173280067649536

Diffusion barrier effect on the thermo-mechanical properties of electroless copper thin films

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