A study of copper process in ultra large scale integrated circuit using plasma immersion ion implantation and electroless copper system
碩士 === 國立清華大學 === 材料科學工程學系 === 89 === in the experiment,our purpose was to grow copper thin films using plasma immersion ion implantation and electroless copper systems.First,we implanted catalyst layer ,such as Pd,Cu etc, using plasma immersion ion implantation in large areas uniformly t...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/18230345920435302614 |