Thermal Stress Analysis of Flip Chip in CSP
碩士 === 國立中山大學 === 機械工程學系研究所 === 89 === Abstract The thesis is aimed to analyze the flip chip in chip scale package (CSP) by finite element method incorporated with software ANSYS due to thermally cyclic loading. The coefficient of thermal expansion (CTE) of underfill and different mechanical propert...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/64085546230673201152 |