The Fabrication of Laser Array Module by Flip Chip Technique
碩士 === 國立中山大學 === 光電工程研究所 === 89 === We have fabricated a laser array module using a passive self-aligned flip-chip bonding technique. Silicon optical bench was used as a submount with PbSn (Tm=183℃) solder bump and V-grooves. A 4-channel laser array was flip-chip mounted with coupling efficiency of...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/45832475565699399323 |
| Summary: | 碩士 === 國立中山大學 === 光電工程研究所 === 89 === We have fabricated a laser array module using a passive self-aligned flip-chip bonding technique. Silicon optical bench was used as a submount with PbSn (Tm=183℃) solder bump and V-grooves. A 4-channel laser array was flip-chip mounted with coupling efficiency of 56% to cleaved 62.5/125μm multimode fiber ribbons. The optimum fabrication parameters were bonding time of 20 seconds and bonding load of 10g. The average misalignments were measured to be 1μm and 5μm for X and Y directions , respectively.
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