Construction of 2.5D microstructure using multiple layers of SU-8 photoresist

• Main Authors: Chi-Hsun Yang, 楊奇勳
• Other Authors: Kang-Ping Chin
• Format: Others
• Language: zh-TW
• Published: 2001
• Online Access: http://ndltd.ncl.edu.tw/handle/14918050315818294603

碩士 === 國立交通大學 === 機械工程系 === 89 === The purpose of this research is to produce a nickel structure by using the UV-LIGA technology. Through the second coating of SU-8 thick photoresist and electroplating, the structure with more shape-changes can be produced. The processes of producing the components and producing the semiconductor are in high compatiblity. Therefore, they can be produced as many as possible. The process of the experiment was divided into two parts: the process of SU-8 thick photoresist and the process of electroplating. The process of SU-8 thick photoresist was started with coating a 35μm SU-8 thick photoresist, followed by another 35μm SU-8 thick photoresist. The pattern plate is 70 μm thick. The thickest pattern of electroplating is 3000 μm, and the thinnest 570μm. The microstructure is 50-60 μm thick.