Hardware/Software Co-design:A Case Study of Next Generation Single Chip PDA

碩士 === 國立交通大學 === 資訊科學系 === 89 === Continued improvement in semiconductor process technology enables designer to put a complex system into a single chip. The so-called System-on-Chip (SoC) consist of application specific hardware components, processors, memory etc. Because of some functionalities wi...

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Main Authors: Hung-Kai Ting, 丁竑愷
Other Authors: Reui-Chuan Chang
Format: Others
Language:zh-TW
Published: 2001
Online Access:http://ndltd.ncl.edu.tw/handle/92727521465698919797
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spelling ndltd-TW-089NCTU03940332016-01-29T04:28:14Z http://ndltd.ncl.edu.tw/handle/92727521465698919797 Hardware/Software Co-design:A Case Study of Next Generation Single Chip PDA 硬體/軟體共同設計:以下一代的單一晶片個人數位助理為例 Hung-Kai Ting 丁竑愷 碩士 國立交通大學 資訊科學系 89 Continued improvement in semiconductor process technology enables designer to put a complex system into a single chip. The so-called System-on-Chip (SoC) consist of application specific hardware components, processors, memory etc. Because of some functionalities will be implemented with software, hardware platform and embedded software should be developed together from starting point. This integration makes design of SoC difficult. Considering System-on-Chip, system-level design plays an important role in the outcome of development. In this thesis, we draw main elements from a single chip personal digital assistant, and use Cadence® Virtual Component Co-Design environment to partition off whole system into hardware and software. With it’s help, we can make design decisions in hardware/software partitioning and hardware specification. We implemented a H.263 software codec. According to the estimation of final system performance and implementation complexity, we decide to implement the system with ARM9 and DSP cores as computing engines. Reui-Chuan Chang 張瑞川 2001 學位論文 ; thesis 52 zh-TW
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description 碩士 === 國立交通大學 === 資訊科學系 === 89 === Continued improvement in semiconductor process technology enables designer to put a complex system into a single chip. The so-called System-on-Chip (SoC) consist of application specific hardware components, processors, memory etc. Because of some functionalities will be implemented with software, hardware platform and embedded software should be developed together from starting point. This integration makes design of SoC difficult. Considering System-on-Chip, system-level design plays an important role in the outcome of development. In this thesis, we draw main elements from a single chip personal digital assistant, and use Cadence® Virtual Component Co-Design environment to partition off whole system into hardware and software. With it’s help, we can make design decisions in hardware/software partitioning and hardware specification. We implemented a H.263 software codec. According to the estimation of final system performance and implementation complexity, we decide to implement the system with ARM9 and DSP cores as computing engines.
author2 Reui-Chuan Chang
author_facet Reui-Chuan Chang
Hung-Kai Ting
丁竑愷
author Hung-Kai Ting
丁竑愷
spellingShingle Hung-Kai Ting
丁竑愷
Hardware/Software Co-design:A Case Study of Next Generation Single Chip PDA
author_sort Hung-Kai Ting
title Hardware/Software Co-design:A Case Study of Next Generation Single Chip PDA
title_short Hardware/Software Co-design:A Case Study of Next Generation Single Chip PDA
title_full Hardware/Software Co-design:A Case Study of Next Generation Single Chip PDA
title_fullStr Hardware/Software Co-design:A Case Study of Next Generation Single Chip PDA
title_full_unstemmed Hardware/Software Co-design:A Case Study of Next Generation Single Chip PDA
title_sort hardware/software co-design:a case study of next generation single chip pda
publishDate 2001
url http://ndltd.ncl.edu.tw/handle/92727521465698919797
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