| Summary: | 碩士 === 義守大學 === 電子工程學系 === 89 === The rise time of signals in PCB (Printed Circuit Board) circuits become shorter, and high speed transmission and high density packaging have become the trend of PCB development. Therefore, when designing a PCB circuit, the electrical characteristics under high frequency circumstance and noise-control can not be ignored. One of the most common noise sources in digital systems is the crosstalk noise, and the crosstalk noise is very significant within high frequency PCB circuits.
Thus, in this thesis, a PCB circuit is simulated by a corresponding coupling multiconductor transmission line model. The unit length parameters of the transmission line can be determined by analytical calculations or numerical simulations. However, analytical solutions are satisfied only under simple circuit and homogeneous medium conditions. If the geometry of PCB circuits is complex and the medium is nonhomogeneous, then these parameters are extracted through numerical methods. However, numerical simulations usually take a lot of time. Thus, in this thesis, these unit length parameters(self-inductance, self-capacitance, mutual-inductance, and mutual-capacitance) are extracted by frequency-domain and time domain measurement methods. A distributed SPICE model is proposed, and the measured parameters are used to simulate the crosstalk. The SPICE model is verified by comparison with experimental measurements,IE3D numerical simulations and analytical results in frequency and time domains.
At last, the effects influence crosstalk noise on PCB circuits is investigated.
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