Influences of Plating Parameters on the Properties of Deposited Ni Film

• Main Authors: Nai-Hsien Chang, 張乃先
• Other Authors: Chi-Shiung Hsi
• Format: Others
• Language: zh-TW
• Published: 2001
• Online Access: http://ndltd.ncl.edu.tw/handle/62857841389119199706

碩士 === 義守大學 === 材料科學與工程學系 === 89 === Nickel metal films were plated onto copper substrates by DC and pulse currents. The relationships between process parameters and properties of deposited films were investigated in this study. Two layers Ni depositions were fabricated by the results obtained from single layer deposition, and assembly tests were used to evaluate two layers deposition. The process conditions used in this research were surface current density 0.5~15.0 A/dm2 in DC plating, pause to pulse ratio 1~5 and pulse frequency 1.67~100Hz in pulse plating. Grain size, residual stress, surface roughness, and hardness of the deposited films were characterized and used to study the influence of each parameter on the property of Ni film. A better process condition was achieved after assembly test. Under the same Watt’s bath, increasing the surface current density, pause to pulse ratio, and decrease the pulse frequency, the average grain size of layers decreased. Decreasing the average grain size of deposited films made the intrinsic stress, hardness and brightness increased, and made the surface roughness and porosity decreased. The results of assembly tests revealed that rougher surface morphology and lower porosity performed better results in wire pull, surface wettability and bending tests. Lower porosity, harder inner layer, and rougher and softer two layers presented the best results of assembly tests.