光電構裝晶片位置量測
碩士 === 中華大學 === 機械與航太工程研究所 === 89 === In optoelectronic packaging, to accurately position the laser diode chip on a silicon bench is a very important theme. In the paper a vision inspection system is developed to determine the position of the chip using the bumps in the silicon bench as a basis of m...
Main Author: | 鍾明勳 |
---|---|
Other Authors: | P.F Luo |
Format: | Others |
Language: | zh-TW |
Published: |
2001
|
Online Access: | http://ndltd.ncl.edu.tw/handle/06561839983712892292 |
Similar Items
-
構裝及晶片寄生效應之研究
by: Lee, Tyler, et al.
Published: (2008) -
晶片強度暨覆晶構裝結構模擬與分析
by: Chen, Shou-Lung, et al.
Published: (2001) -
銅導線/低介電常數半導體晶片之構裝技術研究
by: 林少羽
Published: (2002) -
BGA構裝吸濕效應之量測及其對可靠度影響之探討
by: Liu, Chih-Hung, et al.
Published: (2008) -
BGA黏晶與覆晶構裝晶片之自動檢測
by: 陳彥廷
Published: (2002)