Study on Wafer Testing by Quality Method of probe card
碩士 === 中華大學 === 電機工程學系碩士班 === 89 === Abstract This research will study the problem of low yield in wafer testing. High probe to pad contact resistance was identified as serious wafer testing limiter，both for capability and for cost-effective high volume manufacturing. This prob...
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/86395300837734557691 |