Machine Vision Based Inspection and Classification for PCB Solder Joints Defects
碩士 === 元智大學 === 工業工程研究所 === 88 === To inspect the quality of solder joints defects needs some special illumination arrangement, such as LED、structural light, or some special instrument, such as X-ray、ultrasonic images. Because these equipments are expensive and can’t inspect solder joints defects ef...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/66648719378723402615 |