偶合劑在封裝樹脂之應用與研究

• Main Author: 羅仕洲
• Other Authors: 喬緒明
• Format: Others
• Language: zh-TW
• Published: 2000
• Online Access: http://ndltd.ncl.edu.tw/handle/91763427773877791613

碩士 === 東海大學 === 化學工程學系 === 88 === In order to improve the crumbly behavior of epoxy resins for low temperature application, one intends append polysiloxane to be stress-relief additives to improve its toughness. However, they are not compatible due to the fact that the discrepant on their solubility parameters is high. One way to resolve the this problem is by adding coupling agent to bond epoxy resin and polysiloxane together which in turn raises the capacity of system. To increase the capacity of coupling agent, with a small amount of we first reacted the coupling agent with a small amount of epoxy resin. The reacted coupling agents were then blended into different epoxy systems. Both morphology and impact properties of the polysiloxane-added resin were studied. From the results of the experiment, coupling agent, which reacted with Epikote 828, generated the smallest size of the polysiloxane particles. Only 5 phr significantly of polysiloxane is enough to raise the mechanical properties of the system. We have also discusses the changes in the polysiloxane phase and mechanical properties of the system when silica filler was added.