A Simulation Study on Wafer Temperature in the Rapid Thermal Process

碩士 === 國立臺灣大學 === 機械工程學研究所 === 88 === A Simulation Study on Wafer Temperature in the Rapid Thermal Process In a rapid thermal process, the physical and chemical characteristics of the wafer and the film deposition rate are directly influenced by the temperature distribution on...

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Bibliographic Details
Main Authors: Ming-Hui Lin, 林明輝
Other Authors: Shui-Shong Lu
Format: Others
Language:zh-TW
Published: 2000
Online Access:http://ndltd.ncl.edu.tw/handle/27244606521029004968

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