A study on the transition from platinum thin film to wire bondable metals

• Main Authors: Guann-Shiun Chiou, 邱冠勳
• Other Authors: Prof. Ruey-Shing Huang
• Format: Others
• Language: zh-TW
• Published: 2000
• Online Access: http://ndltd.ncl.edu.tw/handle/33352386103267529440

碩士 === 國立清華大學 === 電子工程研究所 === 88 === It is well know that direct wire bond to platinum thin film is difficult and impractical. This thesis is devoted to the study of the transition from platinum to wire bondable metals such as gold and aluminum. The adhesion property and contact resistance at the transition between metals are studied. Gold or aluminum has poor adherence to platinum. The adhesion property can be improved by providing an intermediate layer. In this thesis, titanium thin film is used to obtain good adhesion between platinum thin film and gold thin film. And chromium thin film is used to obtain good adhesion between platinum thin film and aluminum thin film. We have measured the specific contact resistance（ρc）between platinum thin film and gold and between platinum thin film and aluminum. To demonstrate the applicability of this technology, we used this technology to design a simple platinum thin film microheater, and tested the stability of these structures under operation.