Numerical Investigation on the Thermal Characteristics of a Flip-Chip BGA Package
碩士 === 國立清華大學 === 動力機械工程學系 === 88 === In the present study, the thermal characteristics of the flip-chip BGA package on board are numerically investigated under both natural and forced convection conditions. Heat generated at the junction could be considered to be dissipated by two paths. Heat could...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/58861322769786224607 |