Wetting Behavior and Interfacial Reactions between Lead-Free Solder and EN in UBM
碩士 === 國立清華大學 === 材料科學工程學系 === 88 === Abstract Due to the advantage of BGA technology in number of I/Os over other interconnection method, BGA interconnection technology plays a key role in today's electronic packaging. Good understanding of interfacial reactions between t...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/82462927087658639256 |