Contact Displacement of Diffusion Barrier Layer by Metal Ion and Its Application on IC Process
碩士 === 國立清華大學 === 化學工程學系 === 88 === The fabrication of interconnect has become an essential part of IC industry in recent years. In order to improve the function and efficiency of a chip, the dimension of interconnect must be shrunk to deep submicron. Copper is regarded as the best conducting materi...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/46894933619786988349 |