Logistic Information System Design of Order Fulfillment Process in IC Packaging

碩士 === 國立中央大學 === 工業管理研究所 === 88 === In recent years, Integrated Circuit Packaging (ICP) companies in Taiwan have been incredibly thriving due to the growth of semiconductor industry, which has been considered reaching to the stage of maturity. Meanwhile, in order to meet the challenges of intense c...

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Bibliographic Details
Main Authors: Chung Lung Tsneg, 曾俊龍
Other Authors: 高 信 培
Format: Others
Language:en_US
Published: 2000
Online Access:http://ndltd.ncl.edu.tw/handle/94848722567871163426

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