Logistic Information System Design of Order Fulfillment Process in IC Packaging

• Main Authors: Chung Lung Tsneg, 曾俊龍
• Other Authors: 高 信 培
• Format: Others
• Language: en_US
• Published: 2000
• Online Access: http://ndltd.ncl.edu.tw/handle/94848722567871163426

碩士 === 國立中央大學 === 工業管理研究所 === 88 === In recent years, Integrated Circuit Packaging (ICP) companies in Taiwan have been incredibly thriving due to the growth of semiconductor industry, which has been considered reaching to the stage of maturity. Meanwhile, in order to meet the challenges of intense competition, globalization and gaining greater market share, most ICP companies have increased in size and complexity of business operations. For instance, when multiple-plant operation is replacing single-plant production, the distribution of products from point-of-origin to point-of-consumption has become one of the most important issues. Being perceived as the subject of Supply Chain Management (SCM), how to deliver quality products to the customer in right quantity, at the right time, and with minimum cost is the necessary capability that determines a company’s survival in today’s dynamic business environment. In other words, establishing and maintaining a robust logistic system becomes a most significant competition strategy. Therefore , to enhance logistic system of customer satisfaction , establishment of a complete real-time and multi-function logistic information system (LIS) is must priority for short cycle time and On-Time-Deliver of order fulfillment process (OFP) in IC packaging companies . We provide an innovative modeling technique called Architecture of integrated Information System (ARIS) to model the order fulfillment process .The special features of ARIS are comprised of Function View, Organization View, Data View, and Control View, that is functional, organization, informational, and behavior, to model dynamic process at the same time. The implementation of logistic information system of order fulfillment process can lead to improving shorten cycle time and on-time-deliver for customer service . The logistic information system that link the firm with its vendors, suppliers, subcontractors also offer significant opportunities for profit improvement . Keywords : Integrated Circuit Packaging (ICP), Supply Chain Management (SCM), logistic information system (LIS), order fulfillment process (OFP), Architecture of integrated Information System (ARIS)