Effect of Diffusion Intermetallics Formation between Lead-Free Indium Solder and Copper Substrate

• Main Authors: Yih-Wen Wu, 吳奕文
• Other Authors: Chang Pin Chou
• Format: Others
• Language: zh-TW
• Published: 2000
• Online Access: http://ndltd.ncl.edu.tw/handle/64586382087657240465

碩士 === 國立交通大學 === 機械工程系 === 88 === ABSTRACT With the ongoing concern regarding environmental pollutants, lead is being targeted in industrial application. Compared with conventional lead solders, indium solders could improve the resistance thermal fatigue and alkaline corrosion. The addition of silver and tin into indium-based solder could suppress the melting point and improve wettability. A joint assembly of the Indium (In)-based solders/intermetallic compounds (IMCs)/copper substrate were prepared and experienced a thermal aging test for 20, 100, 200 and 400 hours at 80, 100 and 130℃, respectively. The interfacial diffusion and IMC formation of the assembly were investigated. The thickness of the IMC was measured using an optical microscope (OM).Scanning electron microscope (SEM),electron probe x-ray microanalyzer (EPMA), x-ray differactometer(XRD) technique were used to evaluate the interfacial microstructure. Shear tests were conducted with mechanical test frame run in stroke control mode. Experimental results showed that the thickness of IMC formed by interfacial reaction was increased with the increase of the reaction temperature and the square root of reaction time. The phases in the microstructure of IMC are established. This study also made a comparison of the resistance of shear stress at each solder filler metal.