Effects of Post-treatments on Low Dielectric Constant Materials for Multilevel Interconnect Applications
博士 === 國立交通大學 === 電子工程系 === 88 === In advanced integrated circuits, more than two levels of interconnecting metal layers are necessary, called multilevel interconnects. Electrically insulating materials known as inter-metal dielectrics can provide isolation between these metal layers. In the era of...
Main Authors: | PO-TSUN LIU, 劉柏村 |
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Other Authors: | SIMON-M. SZE |
Format: | Others |
Language: | zh-TW |
Published: |
2000
|
Online Access: | http://ndltd.ncl.edu.tw/handle/57057026480567662514 |
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