Preparation of Ultrafine Alumina Powder and Characterization of Abrasives for Chemical-Mechanical Polishing of Polymer Dielectrics
碩士 === 國立交通大學 === 材料科學與工程系 === 88 === Shrinking the dimensions of devices beyond 0.25 mm or less to increase packing density impose greater demands on the planarization process. Among the newly developed planarization technologies for Ultra Large Scale Integration (ULSI) metallization, ch...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/97253054309402730969 |