The Study of Slurry formulation on Copper Chemical Mechanical Polishing
碩士 === 國立交通大學 === 材料科學與工程系 === 88 === In order to overcome sever limitation of DOP (deep of focus) in deep sub-micro lithography would be necessary to eliminate surface topography a globe planarization technology only by CMP. And based on the problem of RC delay, Cu process must be the ma...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/44084289375201638810 |