Ultrasonic Image Scanning System and Material Evaluation

• Main Authors: Xue Ming-Hua, 薛明華
• Other Authors: Lee Yung-Chun
• Format: Others
• Language: zh-TW
• Published: 2000
• Online Access: http://ndltd.ncl.edu.tw/handle/74051952602766284351

碩士 === 國立成功大學 === 機械工程學系 === 88 === Acoustic image scanning techniques are widely used on various non-destructive applications such as material characterization, defect detection, and failure analysis. Due to its nondestructive feature and its large penetration depth, the acoustic image scanning system is very useful for IC package inspection in semi-conductor industries. In this thesis, we develop an acoustic image scanning system which can be used for IC package inspection as well as for material defect detection. Although such a system has been developed for a long time and is quite mature in the industry, we believe that there are still a lot of improvements can be made if one can thoroughly understand each details of the system. The system’s hardware includes data acquisition board, motion control card, ball screw linear translation stage, servo motor, encoder, ultrasound pulser/receiver, focusing transducer and PC. As for the software, we adopt Microsoft Visual C++ 6.0 and develop the window program for system controlling. Most of frequently used functions of commercial acoustic image scanning systems are incorporated into our system, such as A-Scan、B-Scan、C-Scan。 Finally, we experimentally test and characterize the performance of our system, including resolution, scanning speed and noise disturbance. A number of IC packages that are commonly used in the industry, such as DIP、SOP、SOJ、QFP、BGA, have been actually inspected with the system. Good scanning images of these ICs are obtained and a few improvements have been made to the system to enhance its performance.