The Thermal Analysis of Integrated Circuit Package
碩士 === 國立成功大學 === 機械工程學系 === 88 === The packaging process is very important in the semiconductor industry, because the function and quality of electronic products are affected significant in the packaging operation. This paper investigates the heat dissipation and package warpage of the packaging pr...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/04420170700509517447 |