The Thermal Analysis of Integrated Circuit Package
碩士 === 國立成功大學 === 機械工程學系 === 88 === The packaging process is very important in the semiconductor industry, because the function and quality of electronic products are affected significant in the packaging operation. This paper investigates the heat dissipation and package warpage of the packaging pr...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/04420170700509517447 |
| Summary: | 碩士 === 國立成功大學 === 機械工程學系 === 88 === The packaging process is very important in the semiconductor industry, because the function and quality of electronic products are affected significant in the packaging operation. This paper investigates the heat dissipation and package warpage of the packaging process in the LOC-TSOPⅡ models.
The main objectives of this study are to analyze the package warpage with different temperature assumed states and evaluate the heat dissipation with different sized components. In this paper, we adopt the FEM and the computer numerical simulation to analyze the models.
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