Coplanarity Inspection of Ball Grid Array Using Phase-Shifted Interferometry
碩士 === 國立成功大學 === 電機工程學系 === 88 === In order to increase the functionality of IC-chips, the requirement of high pin count was also increased. Then the BGA packaging technique was developed and used widely. The major problem of surface mounting is the coplanarity of the BGA solder balls. Poor coplana...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2000
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/25448365204433647714 |