| Summary: | 碩士 === 國立中興大學 === 機械工程學系 === 88 === It is very important to solve the problem of heat diffusion for electronic component in high technology today. For the electronic products, a higher temperature of chips will lose accuracy and the life of electronic component damage and cause the unsteadiness of the system.
This paper investigate the three-dimensional heat dissipating problem of the chips in the rectangular channel. The computational fluid code PHOENICS was used to simulate the distribution of temperature and the Nusselt number at various velocity and array. The finite difference method which associate SIMPLE algorithm and hybrid scheme was adopted as the numerical solution to governing equation.
From the computational results, the heat dissipation is better when the velocity is higher. The highest temperature is located in the center of chip. The effect of heat transfer is best at the front side of chip. The circulation appeared at the backside of chip so that the effect of heat transfer is not very good. If we make a hole behind the chips, it would improve the phenomenon of the circulation. In the vertical array, the effect of heat transfer will be better than the horizontal array because the interaction area between fluid and chip is larger.
Key words：rectangular channel, forced convection, chip, PHOENICS
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