Analysis of Heat Transfer in Three-Dimensional Rectangular Channel with Chips
碩士 === 國立中興大學 === 機械工程學系 === 88 === It is very important to solve the problem of heat diffusion for electronic component in high technology today. For the electronic products, a higher temperature of chips will lose accuracy and the life of electronic component damage and cause the unsteadiness of t...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/42102230520333721208 |