| Summary: | 碩士 === 國立清華大學 === 電機工程學系 === 87 === Silicon Anodic Bonding is an important technology in MEMS fabrication. This thesis is dedicated to the comprehensive
study of this technology.
In this study, we discussed the basic theorem of sputtering and anodic bonding. We also made the sputtered glass film by optimization of processing parameters using Robust Design. And then, the glass to silicon bonding current was characterized
and its current model was proposed.
Finally, we analyzed the composition of the sputtered glass film, and have done some measurements about the bonding
strength.
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