Electrochemical deposition Process for ULSI copper interconnect fabrication
碩士 === 國立清華大學 === 化學工程學系 === 87 ===
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ndltd-TW-087NTHU00630062016-07-11T04:13:20Z http://ndltd.ncl.edu.tw/handle/21701027568809907608 Electrochemical deposition Process for ULSI copper interconnect fabrication 電化學程序沉積超大型積體電路銅內連線之研究 馮憲平 碩士 國立清華大學 化學工程學系 87 C.C.Wan 萬其超 1999 學位論文 ; thesis 0 zh-TW |
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zh-TW |
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Others
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碩士 === 國立清華大學 === 化學工程學系 === 87 ===
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author2 |
C.C.Wan |
author_facet |
C.C.Wan 馮憲平 |
author |
馮憲平 |
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馮憲平 Electrochemical deposition Process for ULSI copper interconnect fabrication |
author_sort |
馮憲平 |
title |
Electrochemical deposition Process for ULSI copper interconnect fabrication |
title_short |
Electrochemical deposition Process for ULSI copper interconnect fabrication |
title_full |
Electrochemical deposition Process for ULSI copper interconnect fabrication |
title_fullStr |
Electrochemical deposition Process for ULSI copper interconnect fabrication |
title_full_unstemmed |
Electrochemical deposition Process for ULSI copper interconnect fabrication |
title_sort |
electrochemical deposition process for ulsi copper interconnect fabrication |
publishDate |
1999 |
url |
http://ndltd.ncl.edu.tw/handle/21701027568809907608 |
work_keys_str_mv |
AT féngxiànpíng electrochemicaldepositionprocessforulsicopperinterconnectfabrication AT féngxiànpíng diànhuàxuéchéngxùchénjīchāodàxíngjītǐdiànlùtóngnèiliánxiànzhīyánjiū |
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1718342617794609152 |