Flow Anaysis of Underfill Encapsulation of Flip-Chips
碩士 === 國立清華大學 === 化學工程學系 === 87 === In this paper, the Underfill encapsulation of Flip-Chip is discussed by theoretical analysis. Above all the simulation results have considered the properties of chemorheology for the thermosetting plastic, especially the effect of temperature. Using the generalize...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/32427766482830458595 |