FlipChip黏晶機對準方法之研究
碩士 === 國立中央大學 === 機械工程研究所 === 87 === 英文摘要 Customer demand is driving the evolution of electronic equipment towards smaller devices with increased performance and more features. Therefore, more and more attention is paid to IC packaging by increasing smaller size, higher I/O c...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/69333589752228394051 |