FlipChip黏晶機對準方法之研究

• Main Authors: Chjayu Chen, 陳佳榆
• Other Authors: 黃衍任
• Format: Others
• Language: zh-TW
• Published: 1999
• Online Access: http://ndltd.ncl.edu.tw/handle/69333589752228394051

碩士 === 國立中央大學 === 機械工程研究所 === 87 === 英文摘要 Customer demand is driving the evolution of electronic equipment towards smaller devices with increased performance and more features. Therefore, more and more attention is paid to IC packaging by increasing smaller size, higher I/O counts and excellent electrical properties. Among all IC packaging methods Flip-chip has the ultimate electrical performance and the smallest "package" size, with the capability of very high I/O counts. Since the IC industry produces more than 50 percent revenue in Taiwan, it is very important to develop and manufacture our own flip-chip packaging machines. However, source key manufacturing techniques of flip-chip packaging are still not available to domestic machine companies. Therefore, MIRL(Mechanical Industry Research Laboratories)／ITRI(Industrial Technology Research Institute) launches many practical development and theorietical research projects on the packaging techniques of the filp-chip manufacturing machines. In this projeck, we develop study the patents and papers about flip-chip technologies, and develop new alignment methods for installing flip chips. (KEYWORD： Flip Chip, IC manufacturing, alignment)