Study of the Effect of Metal Oxides on the Interface of Polymer and Copper

• Main Authors: Huang Hsiang-Cheng, 黃祥程
• Other Authors: Hsing-Jen Shiao
• Format: Others
• Language: zh-TW
• Published: 1999
• Online Access: http://ndltd.ncl.edu.tw/handle/48747121587719188914

碩士 === 國立交通大學 === 應用化學系 === 87 === By investigating the pretreatment condition of copper plates with N-β(aminoethyl)γ-aminopropyl methyl dimethyl dimethoxy silane (Silane), ethonal,2,2',2'-nitritotils-titanium(4+) salt (TE), tetraisopropyl titanate (TPT) ,Silica Sol, and ALG, we have demostrated that the deposition have a significant effect on the adhesion and the durability of copper/epoxy joints. Reflection absorption infrared spectroscopy (RAIR) has been used to investigate the effect of different pretreatment on the thermo-oxidative degradation of epoxy system. The diffusion of copper ion was studied by using energy dispersive X-ray spectrometer (EDS). A lab shear strength test and the scanning electron microscope (SEM) were used to investigate the adhesion of the copper/epoxy joints. It is concluded that all of these pretreatment agents have the nature to improve the degradation of epoxy because the decrease of copper ion diffusion. In general, the ALG and Silica Sol seem to be the better pretreatment agents.