A Study of Reactive Ion-Beam Etch Process on the Via Formation
碩士 === 國立交通大學 === 材料科學與工程系 === 87 === This experiment is to fabricate a multi-layer interconnect substrate containing x-y circuits. The main theme of this study is on the characteristics of RIE etching technique applied to polyimide (PI) in order to gain a better understanding on the ef...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/44464124964682120890 |